ANTISTATIC MATERIALS AT HIGHER TEMPERATURES
EARLIER IN THIS MONTH'S ISSUE, I LISTED UNITED COMPOSITES FAMILY
OF ANTISTATIC COMPOUNDS. THESE MATERIALS ARE BASED ON A SURFACTANT
TECHNOLOGY AND WORKS WELL FOR MATERIALS THAT PROCESS BELOW 415
DEGREES F. THAT FAMILY INCLUDES ABS, LDPE, STYRENE, HDPE, AND
POLYPROPYLENE. BUT WHAT ABOUT HIGHER TEMPERATURE APPLICATIONS
REQUIRING HIGHER HEAT RESISTANT PLASTICS ?
THE ANSWER TO THAT QUESTION LIES IN THE ABILITY TO COMPOUND CARBON
FIBER AND/OR CARBON POWDER AT EXACT RATIOS TO ACHIEVE CONDUCTIVITY
AT THE ANTISTAT RANGE - 10(9) TO 10(12) OHMS PER SQUARE RESISTIVITY.
THIS RANGE ALLOWS FOR A SLOW CONSTANT DRAIN OF ELECTROSTATIC ENERGY
WITHOUT DAMAGING SURGES OR STATIC BUILD-UP. SEMICONDUCTOR MANUFACTURES,
CHIP CARRIER OEM'S, PRINTER MANUFACTURERS, MEDICAL/OXYGEN ENVIRONMENTS,
COMPUTER OEM'S AND MANY OTHER END-USERS ARE NOW REQUIRING THESE
UNIQUE PROPERTIES FOR THEIR APPLICATIONS.
LISTED BELOW ARE A FEW NEW FORMULATIONS THAT ARE BEING FORMULATED
IN THE HIGHER HEAT RESISTANT MATERIALS TO PROVIDE ANTISTATIC PROPERTIES,
HEAT RESISTANCE, LITTLE TO NO SLOUGHING (CRAYON EFFECT) AND GOOD
MECHANICAL PROPERTIES.
Plasco Material Code |
BASE RESINS | SP. GRVT | TEN. STR. | FLEX STR. | UNN. IZOD | SURF. RESIS. | STAT DECAY | HDT |
PZC 300 EZ | PEI | 1.30 | 18K | 27K | 10 |
10(9) 10(12) |
<0.50 | 400F |
PCC 300 EG | PC | 1.23 | 15K | 23K | 14 |
10(9) 10(12) |
<0.50 | 290F |
PBC 300 EG | PBT | 1.35 | 14K | 26K | 7 |
10(9) 10(12) |
,0.50 | 380F |